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Welcome Message

  • Welcome to the official website of 2023 4th International Conference on Computer Science and Communication Technology (ICCSCT 2023). 
  • Organized by Beijing University of Chemical Technology, Liverpool John Moores University and Hubei Zhongke Institute of Geology and Environment Technology, 2023 4th International Conference on Computer Science and Communication Technology (ICCSCT 2023) will be held on July 26th-28th, 2023 in Wuhan, China.

  • Aiming at bringing together innovative academicians and industrial experts in the field of communication technology and computer science to a common forum, ICCSCT tries to provide an academic platform on the communication of latest research and developmental activities in related areas and promote scientific information interchange between researchers, developers, engineers, students, and practitioners working all around the world.

  • During the conference, there will be substantial time for presentations and discussions. In addition, poster sessions and exhibitions offer valuable opportunity for exchanging information among delegates and participants, especially for those who are looking for new opportunities between presenters and participants.

  • Committee of ICCSCT 2023 continues  to make an effort to hold ICCSCT conference successfully by working with the best editors and reviewer teams.
  • ICCSCT 2023 accepts unpublished research abstracts and papers written in English. All accepted and registered papers will be published as conference proceeding and submitted to be indexed by EI-Compendex and SCOPUS, etc.

  • We look forward to seeing you at the Conference and also your contributions (abstracts and full papers are both welcome.).


  • Conference Organizer
  • Beijing University of Chemical Technology
  • Liverpool John Moores University
  • Hubei Zhongke Institute of Geology and Environment Technology

Publication

  • Accepted full papers will be published as conference proceeding and submitted to EI Compendex and SCOPUS, etc.
  • Please note that accepted abstracts will only be presenters (oral or poster) during the conference; no further publication will be proceeded. 

Peer Review

  • Each submitted abstract/paper will be incorporated with a rigorous double-blind review process by at least two competent reviewers.

Important Dates

  • Conference Date :
  • July 26th-28th, 2023
  • [Final Round] Abstract Submission DDL:
  • June 5th, 2023
  • [Final Round] Full Paper Submission DDL:
  • June 20th, 2023

Contact

Submission

  • All abstracts/papers should be submitted through ICCSCT's official submission system at 

Submission

Review

  • Please log into the official review system as reviewer for paper reviewing at

Review

Publication

Accepted papers by ICCSCT 2023 will be published as conference proceeding and submitted to be indexed in EI Compendex, SCOPUS, etc.


Selected excellent papers will be published by the following SCI journals:

1. Special Issue "Toward Performance Optimization of Wireless Sensor Networks and Sensor Node Devices in Environmental Monitoring" with Sensors, SCI-indexed, IF 3.576

Topics include:

cost (of node, energy consumption, maintenance);

energy (self-powered sensors, stability, environmental protection);

communication (security, scalability);

data processing (distributed, big data, robustness);

WSNs design and validation;

Artificial intelligence in WSNs;

Industrial WSNs;

Body Sensor Networks;

Flexible sensors;

Novel sensor device for WSNs.

Detailed information can be found at https://www.mdpi.com/journal/sensors/special_issues/WSN_loT_EM.


2. Special Issue "Building Three-Dimensional Integrated Circuits and Microsystems" with Processes, SCI-indexed, IF 2.847

Topics include:

Micro/nano fabrication technology related to 3D integration, e.g., Cu–Cu pilar bump bonding, high-density RDL, TSV fabrication, Cu pillar, wafer bonding, etc.;

2.5D/3D heterogeneous integration, fan-out packaging, 3D hybrid integration, RF 3D integration, 3D passive device, 3D antenna, 3D heterogeneous opto-electronic integration, and thermal management;

Design Automation, process/device/packaging simulation, and thermal mechanical reliability of 3D integration;

Novel materials, components, circuits and technology to be used in 3D integration, e.g., 2D materials, triboelectronic nanogenerator, artificial intelligence, etc.

Detailed information can be found at https://www.mdpi.com/journal/processes/special_issues/TDIC.