- 2023 4th International Conference on Computer Science and Communication Technology
- ICCSCT 2023
- July 26th-28th, 2023
Wuhan, China
Aiming at bringing together innovative academicians and industrial experts in the field of communication technology and computer science to a common forum, ICCSCT tries to provide an academic platform on the communication of latest research and developmental activities in related areas and promote scientific information interchange between researchers, developers, engineers, students, and practitioners working all around the world.
During the conference, there will be substantial time for presentations and discussions. In addition, poster sessions and exhibitions offer valuable opportunity for exchanging information among delegates and participants, especially for those who are looking for new opportunities between presenters and participants.
We look forward to seeing you at the Conference and also your contributions (abstracts and full papers are both welcome.).
Submission
Accepted papers by ICCSCT 2023 will be published as conference proceeding and submitted to be indexed in EI Compendex, SCOPUS, etc.
Selected excellent papers will be published by the following SCI journals:
1. Special Issue "Toward Performance Optimization of Wireless Sensor Networks and Sensor Node Devices in Environmental Monitoring" with Sensors, SCI-indexed, IF 3.576
Topics include:
cost (of node, energy consumption, maintenance);
energy (self-powered sensors, stability, environmental protection);
communication (security, scalability);
data processing (distributed, big data, robustness);
WSNs design and validation;
Artificial intelligence in WSNs;
Industrial WSNs;
Body Sensor Networks;
Flexible sensors;
Novel sensor device for WSNs.
Detailed information can be found at https://www.mdpi.com/journal/sensors/special_issues/WSN_loT_EM.
2. Special Issue "Building Three-Dimensional Integrated Circuits and Microsystems" with Processes, SCI-indexed, IF 2.847
Topics include:
Micro/nano fabrication technology related to 3D integration, e.g., Cu–Cu pilar bump bonding, high-density RDL, TSV fabrication, Cu pillar, wafer bonding, etc.;
2.5D/3D heterogeneous integration, fan-out packaging, 3D hybrid integration, RF 3D integration, 3D passive device, 3D antenna, 3D heterogeneous opto-electronic integration, and thermal management;
Design Automation, process/device/packaging simulation, and thermal mechanical reliability of 3D integration;
Novel materials, components, circuits and technology to be used in 3D integration, e.g., 2D materials, triboelectronic nanogenerator, artificial intelligence, etc.
Detailed information can be found at https://www.mdpi.com/journal/processes/special_issues/TDIC.